SMD Package
Showing all 22 results
FKC03
FEATURES
• NO MINIMUM LOAD REQUIRED
• 1600VDC INPUT TO OUTPUT ISOLATION
• STANDARD 1.25 X 0.80 X 0.40 INCH 24 PIN DIP AND SMD PACKAGE
• UL60950-1, EN60950-1 , & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
FKC05
FEATURES
• NO MINIMUM LOAD REQUIRED
• 1600VDC INPUT TO OUTPUT ISOLATION
• STANDARD 1.25 X 0.80 X 0.40 INCH 24 PIN DIP AND SMD PACKAGE
• UL60950-1, EN60950-1 , & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
FKC05W
FEATURES
• NO MINIMUM LOAD REQUIRED
• 1600VDC INPUT TO OUTPUT ISOLATION
• STANDARD 1.25 X 0.80 X 0.40 INCH 24 PIN DIP AND SMD PACKAGE
• UL60950-1, EN60950-1 , & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
FKC08
FEATURES
• NO MINIMUM LOAD REQUIRED
• 1600VDC INPUT TO OUTPUT ISOLATION
• STANDARD 1.25 X 0.80 X 0.40 INCH 24 PIN DIP AND SMD PACKAGE
• UL60950-1, EN60950-1 , & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
FKC08W
FEATURES
• NO MINIMUM LOAD REQUIRED
• 1600VDC INPUT TO OUTPUT ISOLATION
• STANDARD 1.25 X 0.80 X 0.40 INCH 24 PIN DIP AND SMD PACKAGE
• UL60950-1, EN60950-1, IEC60950-1, & EN50155 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• RAILWAY SYSTEM
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
FKC12
FEATURES
• NO MINIMUM LOAD REQUIRED
• 1600VDC INPUT TO OUTPUT ISOLATION
• STANDARD 1.25 X 0.80 X 0.40 INCH 24 PIN DIP AND SMD PACKAGE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
FKC12W
FEATURES
• NO MINIMUM LOAD REQUIRED
• 1600VDC INPUT TO OUTPUT ISOLATION
• STANDARD 1.25 X 0.80 X 0.40 INCH 24 PIN DIP AND SMD PACKAGE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
FKC15
FEATURES
• NO MINIMUM LOAD REQUIRED
• 1600VDC INPUT TO OUTPUT ISOLATION
• STANDARD 1.25 X 0.80 X 0.40 INCH AND 24 PIN DIP PACKAGE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
FKC15W
FEATURES
• NO MINIMUM LOAD REQUIRED
• 1600VDC INPUT TO OUTPUT ISOLATION
• STANDARD 1.25 X 0.80 X 0.40 INCH AND 24 PIN DIP PACKAGE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
LED15W
FEATURES
• NO MINIMUM LOAD REQUIRED
• 2250VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE：1.10 x 0.94 x 0.34 INCH
• SURFACE-MOUNT OR THROUGH-HOLE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
MKC03
FEATURES
• 3 WATTS REGULATED OUTPUT POWER
• OUTPUT CURRENT UP TO 0.5A
• STANDARD 1.25 X 0.80 X 0.40 INCH
• HIGH EFFICIENCY UP TO 80%
• 2:1 WIDE INPUT VOLTAGE RANGE
• FIVE-SIDED SHIELD
• FIXED SWITCHING FREQUENCY (300kHz)
• STANDARD 24 PIN DIP PACKAGE & SMD TYPE PACKAGE
• OVER CURRENT PROTECTION
• OUTPUT 1 / OUTPUT 2 ISOLATION (DS TYPE)
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• Measurement Equipment
• SEMICONDUCTOR EQUIPMENT
PDS02
FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE：0.74 X 0.50 X 0.33 INCH
• LOW OUTPUT RIPPLE AND NOISE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
PDS02W
FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE：0.74 X 0.50 X 0.33 INCH
• LOW OUTPUT RIPPLE AND NOISE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
PDS03
FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE：0.74 X 0.50 X 0.33 INCH
• LOW OUTPUT RIPPLE AND NOISE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
PDS03W
FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE：0.74 X 0.50 X 0.33 INCH
• LOW OUTPUT RIPPLE AND NOISE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT
PFKC03
FEATURES
• 3 WATTS REGULATED OUTPUT POWER
• OUTPUT CURRENT UP TO 600mA
• STANDARD 1.25 X 0.80 X 0.40 INCH
• HIGH EFFICIENCY UP TO 80%
• 2:1 WIDE INPUT VOLTAGE RANGE
• SWITCHING FREQUENCY (100kHz, MIN)
• OVER CURRENT PROTECTION
• STANDARD 24 PIN DIP PACKAGE & SMD TYPE PACKAGE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• Wireless Network
• Telecom/Datacom
• Industry Control System
• Measurement Equipment
• Semiconductor Equipment
PFKC05
FEATURES
• 5 WATTS REGULATED OUTPUT POWER
• OUTPUT CURRENT UP TO 1000mA
• STANDARD 1.25 X 0.80 X 0.40 INCH
• HIGH EFFICIENCY UP TO 81%
• 2:1 WIDE INPUT VOLTAGE RANGE
• SWITCHING FREQUENCY (100kHz, MIN)
• OVER CURRENT PROTECTION
• STANDARD 24 PIN DIP PACKAGE & SMD TYPE PACKAGE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• Wireless Network
• Telecom/Datacom
• Industry Control System
• Measurement Equipment
• Semiconductor Equipment
PMKC03
FEATURES
• 3 WATTS REGULATED OUTPUT POWER
• OUTPUT CURRENT UP TO 600mA
• STANDARD 1.25 X 0.80X 0.40 INCH
• HIGH EFFICIENCY UP TO 80%
• 2:1 WIDE INPUT VOLTAGE RANGE
• SWITCHING FREQUENCY (100kHz, MIN)
• INCLUDE 3.3VDC OUTPUT
• STANDARD 24 PIN DIP PACKAGE & SMD TYPE PACKAGE
• DUAL SEPARATE OUTPUT
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• Wireless Network
• Telecom/Datacom
• Industry Control System
• Measurement Equipment
• Semiconductor Equipment
SDH03W
FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT
SDS01
FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS ACCORDING IPC J-STD-020D
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT
SDS01W
FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS
ACCORDING IPC J-STD-020D
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT
SDS02
FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS
ACCORDING IPC J-STD-020D
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT