16A

FEATURES
• OUTPUT CURRENT UP TO 16A
• SMALL SIZE AND LOW PROFILE :
1.30” X 0.53” X 0.30” (SMD) ; 2.00” X 0.50” X 0.28” (SIP)
• HIGH EFFICIENCY UP TO 95% @ 3.3V FULL LOAD
• INPUT RANGE FROM 2.4VDC TO 5.5VDC
• FIXED SWITCHING FREQUENCY (300kHZ)
• SMD & SIP PACKAGES
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER
PROCESS ACCORDING IPC J-STD-020D
• OUTPUT VOLTAGE PROGRAMMABLE FROM 0.75VDC TO 3.3VDC VIA EXTERNAL RESISTOR
• INPUT UNDER-VOLTAGE PROTECTION
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• Wireless Network
• Telecom/Datacom
• Industry Control System
• Distributed Power Architectures
• Semiconductor Equipment
• Microprocessor Power Applications

FEATURES
• OUTPUT CURRENT UP TO 16A
• SMALL SIZE AND LOW PROFILE : 1.30” X 0.53” X 0.30” (SMD) ; 2.00” X 0.50” X 0.28” (SIP)
• HIGH EFFICIENCY UP TO 92% @ 3.3V FULL LOAD
• INPUT RANGE FROM 8.3VDC TO 14.0VDC
• FIXED SWITCHING FREQUENCY (300KHZ)
• SMD & SIP PACKAGES
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS ACCORDING IPC J-STD-020D
• OUTPUT VOLTAGE PROGRAMMABLE FROM 0.75VDC TO 5.0VDC VIA EXTERNAL RESISTOR
• INPUT UNDER-VOLTAGE PROTECTION
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• Wireless Network
• Telecom/Datacom
• Industry Control System
• Distributed Power Architectures
• Semiconductor Equipment
• Microprocessor Power Applications