Output: 10A Datasheet
FEATURES
• OUTPUT CURRENT UP TO 10A
• SMALL SIZE AND LOW PROFILE : 1.30” X 0.53” X 0.30” (SMD) ; 2.00” X 0.50” X 0.28” (SIP)
• HIGH EFFICIENCY UP TO 93% @ 3.3V FULL LOAD
• INPUT RANGE FROM 8.3VDC TO 14.0VDC
• FIXED SWITCHING FREQUENCY (300kHZ)
• SMD & SIP PACKAGES
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS ACCORDING IPC J-STD-020D
• OUTPUT VOLTAGE PROGRAMMABLE FROM 0.75VDC TO 5.0VDC VIA EXTERNAL RESISTOR
• INPUT UNDER-VOLTAGE PROTECTION
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• Wireless Network
• Telecom/Datacom
• Industry Control System
• Distributed Power Architectures
• Semiconductor Equipment
• Microprocessor Power Applications
| Model Name | ON/OFF
Logic |
Package | Input Voltage | Output Voltage | Output Current | Efficiency (%)
12Vin, 3.3VDC@10A |
|
| Min. Load | Max. Load | ||||||
| DOS10-12T | Negative | SMD | Vout(set)≦3.63V
Vin = 8.3-14VDC
Vout(set)＞3.63V Vin = 8.3-13.2VDC |
0.75 ~ 5.0VDC | 0A | 10A | 93% |
| DOS10-12T-P | Positive | ||||||
| DOH10-12T | Negative | Vertical Mounting
SIP |
|||||
| DOH10-12T-P | Positive | ||||||
| DOH10-12TA | Negative | Horizontal Mounting
SIP |
|||||
| DOH10-12TA-P | Positive | ||||||
FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS
ACCORDING IPC J-STD-020D
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT
FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS ACCORDING IPC J-STD-020D
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT
FEATURES
• NO MINIMUM LOAD REQUIRED
• 1600VDC INPUT TO OUTPUT ISOLATION
• SCREW TERMINALS FOR INPUT AND OUTPUT CONNECTIONS
• RELIABLE SNAP-ON FOR DIN RAIL TS-35/7.5 OR TS-35/15
• CASE PROTECTION MEET IP20(IEC60529)
• INTERNAL OUTPUT DC-OK INDICATOR
• MEET EN55022 CLASS B
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• COMMUNICATION SYSTEM
• INDUSTRY CONTROL SYSTEM
• FACTORY AUTOMATIC EQUIPMENT
• SEMICONDUCTOR EQUIPMENT
FEATURES
• OUTPUT CURRENT UP TO 6A
• SMALL SIZE AND LOW PROFILE :
0.80” X 0.45” X 0.22” (SMD) ; 0.9” X 0.40” X 0.20” (SIP)
• HIGH EFFICIENCY UP TO 94% @ 3.3V FULL LOAD
• INPUT RANGE FROM 2.4VDC TO 5.5VDC
• FIXED SWITCHING FREQUENCY
• SMD & SIP PACKAGES
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS ACCORDING IPC J-STD-020D
• OUTPUT VOLTAGE PROGRAMMABLE FROM 0.75VDC TO 3.3VDC VIA EXTERNAL RESISTOR
• INPUT UNDER-VOLTAGE PROTECTION
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• Wireless Network
• Telecom/Datacom
• Industry Control System
• Distributed Power Architectures
• Semiconductor Equipment
• Microprocessor Power Applications
FEATURES
• OUTPUT CURRENT UP TO 10A
• SMALL SIZE AND LOW PROFILE : 1.30” X 0.53” X 0.30” (SMD) ; 2.00” X 0.50” X 0.28” (SIP)
• HIGH EFFICIENCY UP TO 93% @ 3.3V FULL LOAD
• INPUT RANGE FROM 8.3VDC TO 14.0VDC
• FIXED SWITCHING FREQUENCY (300kHZ)
• SMD & SIP PACKAGES
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS ACCORDING IPC J-STD-020D
• OUTPUT VOLTAGE PROGRAMMABLE FROM 0.75VDC TO 5.0VDC VIA EXTERNAL RESISTOR
• INPUT UNDER-VOLTAGE PROTECTION
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH
APPLICATIONS
• Wireless Network
• Telecom/Datacom
• Industry Control System
• Distributed Power Architectures
• Semiconductor Equipment
• Microprocessor Power Applications