DOS06-05T / DOH06-05T

• "NO MINIMUM LOAD REQUIRED
• SMALL SIZE AND LOW PROFILE:\nSMD TYPE:0.80 X 0.45 X 0.21 INCH , SIP TYPE:0.90 X 0.40 X 0.20 INCH
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS ACCORDING IPC J-STD-020D
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS"