DOS16-05T / DOH16-05T

• "NO MINIMUM LOAD REQUIRED
• SMALL SIZE AND LOW PROFILE : SMD TYPE:1.30 X 0.53 X 0.30 INCH , SIP TYPE:2.00 X 0.50 X 0.28 INCH
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS ACCORDING IPC J-STD-020D
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS"